Cutting disc corrosion A/B: After being machined by slicing and grinding, the damaged layer formed by the processing stress on the surface of the wafer is usually removed by chemical etching. Corrosion A is acid corrosion. The damaged layer is removed by mixed acid solution to produce hydrogen fluoride, NOX and waste mixed acid; corrosion B is alkaline corrosion, and the damaged layer is removed with sodium hydroxide solution to produce waste alkali liquor. Some of the silicon wafers in this project use corrosion A and some use corrosion B.
Cutting plate binning monitoring: damage detection of the silicon wafer, and the damaged silicon wafer is re-corroded.
Rough cutting disc: use a single abrasive to remove the damaged layer, generally removing 10~20um. Here, a rough throw waste liquid is produced.
Fine cutting disc: The use of fine grinding agent to improve the micro-roughness of the surface of the silicon wafer, generally less than 1 um, thus to a high flatness wafer. Produce fine polishing waste liquid.
Inspection of the flat cutting disc on sale: Check if the silicon wafer meets the requirements, if not, re-polish or RCA cleaning.
Inspection: Check if the surface of the silicon wafer is clean, if the surface is not clean, it will be cleaned until it is cleaned.
Packaging: The single crystal silicon cutting disk is packaged.
Decryption of diamond cutting blades
As a cutting tool, diamond cutting disc is widely used in the processing of hard and brittle materials such as stone, concrete, prefabricated panels, new and old roads, ceramics.
At present, the aluminum flat cutting disc is mainly composed of two parts; the base body and the cutter head. The base body is the main support part of the bonding cutter head, and the cutter head is the part which is cut during use, and the cutter head is continuously consumed in use. The base is not, the reason why the cutter can cut is because it contains diamonds.
As the hardest substance in the world, diamond rubs and cuts the object to be processed in the cutter head. However, the diamond particles are wrapped in metal inside the cutter head.